Showing results: 16 - 30 of 34 items found.
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MicroContact AG
Frequently, manual test adapters are required for the functional and IC test. In order to contact the test subject, spring contact probes are often installed in the adapter, but the pitch of the spring contact probes is approx. 1.27 mm and thus too great for certain applications.
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Omega Engineering, Inc
Used for immersion temperature measurement in liquids, air, gas, or wells in solid material, Omega offers a large variety of probe styles in thermocouple, RTD, thermistor, and IC technologies.
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PRB-HP-9250 -
TEAM SOLUTIONS, INC.
*Up to 250MHz*Includes a handy storage pouch and includes an IC test-hook adapter for the probe.*The BNC connector rotates to avoid cable tangle or kink.*Cable length is 1.4 meters.
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PRB-HP-9060 -
TEAM SOLUTIONS, INC.
*Up to 60MHz*Includes a handy storage pouch and includes an IC test-hook adapter for the probe.*The BNC connector rotates to avoid cable tangle or kink.*Cable length is 1.4 meters.
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MFA 01 set -
Langer EMV-Technik GmbH
The micro probes are used to measure magnetic fields and they have a high resolution. They measure magnetic fields up to 6 GHz, e.g. at signal conductors (150µm), SMD components (0603-0201) or IC pins. The MFA micro probes are guided by hand. An amplifier stage is integrated into the probe head. The amplifier stage (9V, 100mA) is powered via the Bias tee BT 706. It has an impedance of 50 Ohm. The micro probes are connected via the Bias tee BT 706 to a spectrum analyzer or an oscilloscope. Langer EMV-Technik GmbH includes correction lines in the delivery. With the help of the correction lines the probe output voltage is converted either into the respective magnetic field or to the current which is running through the conductor.
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MFA 02 set -
Langer EMV-Technik GmbH
The two in the set included micro probes are used to measure low-frequency magnetic fields up to 1 GHz, e.g. at signal conductors (150µm), SMD componets (0603-0201) or IC pins. The MFA micro probes are guided by hand. An amplifier stage is integrated into the probe head. The amplifier stage (9V, 100mA) is powered via the BT 706 Bias tee. It has an impedance of 50 Ohm. The micro probes are connected via the Bias tee to a spectrum analyzer or an oscilloscope. The MFA 02 set delivery of Langer EMV-Technik GmbH includes correction lines. With the help of the correction lines the probe output voltage is converted either into the respective magnetic field or to the current which is running through the conductor.
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ICFP -
Ardent Concepts, Inc.
Ardent’s ICFP is a next generation coaxial cable termination toolkit for advanced system design de-embedding, de-bugging, and calibration. Designed for the lowest loss access to signal paths on an IC circuit footprint, this solution is a simple, cost effective alternative to expensive probers and x-y tables for Engineers who need to probe multiple signals at once.
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6HP-9060 -
Prokit's Industries Co., Ltd.
Switchable X1/X10/X100 attenuation with reference switch positions. Break-resistant center conductor & wide compensation range. Flatter response, sharper leading edges. Faster rise time and replaceable cable probe head tip and ground lead. Max. input voltage: 600V/1200V (DC-peak AC). Includes BNC adapter, IC tip, insulating tip & trimming tool.
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Libelium Comunicaciones Distribuidas S.L
Robust waterproof IP65 enclosure.11 models integrating more than 150 sensors.Add or change a sensor probe in seconds.Solar powered with external panel.Radios: 802.15.4, 868, 900, WiFi, 4G, Sigfox and LoRaWAN.Over the Air Programming (OTA).Special brackets ready for street lights installation.Fully certified for the main markets: CE, FCC, IC, ANATEL, RCM, PTCRB, AT&T.
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RF1 set -
Langer EMV-Technik GmbH
The RF1 near field probe set consists of 4 passive near field probes for making measurements in the development phase of E-field and magnetic field in the ranges of 30 MHz to 3 GHz on electronic assemblies. The probe heads of the RF1 set allow for measurements close to the electronic assemblies, e.g. on single IC pins, conducting paths, components and their connectors in order to localize interference sources. Field orientation and field distribution on an electronic assembly can be detected through a trained special use of the near field probe. The near field probes are small and handy. They have a sheath current attenuation and are electrically shielded. They can be connected to a spectrum analyzer or an oscilloscope with a 50 Ω input. They do not have an internal terminating resistance.
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SX set -
Langer EMV-Technik GmbH
The SX1 set consists of 3 passive near field probes for making measurements in the development phase of E-field and magnetic field with a high clock frequency in the range from 1 GHz to 10 GHz. The probe heads of the set SX allow for measurements close to electronic assemblies, e.g. on single IC pins, conducting paths, components and their connectors, to localize interference sources. Field orientation and field distribution on an electronic assembly can be detected through trained use of the near field probe. The near field probes are small and handy. They have a sheath current attenuation and are electrically shielded. They can be connected to a spectrum analyzer or an oscilloscope with a 50 Ω input. They have an internal terminating resistance.
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MicroContact AG
With the micro probes and the fine-pitch adapters used on them, you are able to contact the finest test structures. E-tests, functional tests, IC tests or high-current tests are made to be affordable, efficient and with a short cycle time. With the integration of HF adapters we also enable the double-sided testing of HF substrates up to high frequency ranges.
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LogicTouch -
SV Probe, Inc.
The shrinking of IC die geometries and the growing complexity of device designs are making the task of on-wafer testing increasingly more difficult. SV TCL''s LogicTouchTM is suited perfectly for these types of advanced designs, a fine pitch technology utilizing a MEMS-style probe targeted for pad-limited devices such as High-Volume SoCs, Microcontrollers, DSPs and 3D Packages. LogicTouch is also ideal for the latest device applications including TSV (Through-Silicon Via) and Copper Pillar (Cu-Pillar).
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MPI Advanced Semiconductor Test
MPI’s 200 mm and 300 mm automated probe systems are dedicated and designed to address current and future requirements for all facets of Device Characterization for Modeling and Technology/Process Development, Failure Analysis, Design Verification, IC engineering, Wafer Level Reliability as well as special requirements for MEMS, High Power, RF and mmW device testing.
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Wewon Environmental Chambers Co, Ltd.
Probe card manufacturing need the semiconductor test equipment. When we designed the thermal testing equipment, Only some commonly used test items are packaged into the IC tester, and the logic function of the verification chip is implemented in a fixed test mode. But as chip products diversify, Some thermal inducing system can no longer do it alonehttps://www.wewontech.com/semiconductor-test-equipment/